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COOLSERVER R63 4 Heatpipe 2U Servidor CPU Disipador Estación de trabajo Ventilador de refrigeración para computadora para Intel LGA2011 1700 115X AMD AM4
35,89€45,18€
Color : R63-1 LGA2011
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The CPU base size of R63-1 LGA2011 is 80*80mm, and the CPU base size of R63 LGA2011 is 94*56mm.
LGA 2011-R63-1 specifications
Brand: COOLSERVER
Product model: LGA 2011-R63-1
CPU type: LGA 2011 (square motherboard)
Voltage: 12V
Product size: L90*W90*H65mm
Fan speed: PWM 3000-6800RPM
Noise level: 49.4dBA (MAX)
Air volume: 34. 74CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
CPU hole distance: 80*80mm
Material: aluminum fins + 4 heat pipes
Power consumption: 165W
LGA 2011-R63 specifications
Brand: COOLSERVER
Product model: LGA 2011-R63
CPU type: LGA 2011 (rectangular motherboard)
Voltage: 12V
Product size: L90*W90*H65mm
Fan speed: PWM 3000-6800RPM
Noise level: 49.4dBA (MAX)
Air volume: 34. 74CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
CPU hole distance: 94*56mm
Material: aluminum fins + 4 heat pipes
Power consumption: 165W
LGA 1700-R63 specifications
Brand: COOLSERVER
Product model: LGA 1700-R63
CPU type: LGA 1700 (square motherboard)
Voltage: 12V
Product size: L90*W90*H65mm
Fan speed: PWM 3000-6800RPM
Noise level: 49.4dBA (MAX)
Air volume: 34. 74CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
CPU hole distance: 78*78mm
Material: aluminum fins + 4 heat pipes
Power consumption: 165W
LGA 115X-R63 specifications
Brand: COOLSERVER
Product model: LGA 115X-R63
CPU type: LGA 115X (square motherboard)
Voltage: 12V
Product size: L90*W90*H65mm
Fan speed: PWM 3000-6800RPM
Noise level: 49.4dBA (MAX)
Air volume: 34. 74CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
CPU hole distance: 75*75mm
Material: aluminum fins + 4 heat pipes
Power consumption: 165W
LGA AM4-R63 specifications
Brand: COOLSERVER
Product model: AMD AM4-R63
CPU type: AMD AM4 (rectangular motherboard)
Voltage: 12V
Product size: L90*W90*H65mm
Fan speed: PWM 3000-6800RPM
Noise level: 49.4dBA (MAX)
Air volume: 34. 74CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
CPU hole distance: 90*54mm
Material: aluminum fins + 4 heat pipes
Power consumption: 165W
Using FIN and buckle FIN process
1. Between the radiator fin and the copper tube, the fin manufacturing process is adopted, and the fin and fin technology are combined to increase the surface heat dissipation area and stabilize the fin spacing.
2. The fins of the heat sink adopt fin technology not only to increase the firmness, but also to keep the spacing of each fin consistent. The airflow generated by the fan passes through each fin evenly and smoothly, thereby reducing wind cutting noise and enhancing heat dissipation. performance.
Using 6025 fan
Imported lc original components, silent, stable, strong wind, large air volume, fast and efficient heat dissipation
